Ceramic PCB (AlN / DBC / AMB) Solutions
Engineering-Driven · High Reliability · Supports Small to Medium Batch Production
With extensive engineering experience and advanced manufacturing capabilities, Chongyu Technology provides full-process PCB support from design evaluation to production, ensuring signal integrity, efficient manufacturing, and controlled risk.
Common Concerns
Why do ceramic PCB prices vary so much?
Differences in materials (AlN / Al₂O₃ / Si₃N₄) and processes (DBC / AMB / heavy copper) can be significant. We provide material and process selection recommendations based on your application needs, helping you achieve the optimal balance between performance and cost.
Design looks fine, why is temperature still high?
For high-power applications such as IGBT and laser systems, we offer material selection and structural optimization to ensure thermal performance meets your design needs.
Can prototype lead time be consistent?
Supports fast prototyping within 8–18 days and provides stable mass production delivery to avoid project delays.
How to reduce repeated design revisions?
Early-stage engineering evaluation helps optimize materials, structure, and processes, reducing trial-and-error and accelerating project implementation.
Core Capabilities
High-Speed Signal PCB (Servers / AI / Networking)
- Experience with 112G / 224G signal projects, providing material and stack-up guidance
- Low-loss materials (Rogers / Megtron) selection support
- Stable prototyping to small-batch production
Thermal Management Ceramic PCB (IGBT / Laser)
- Material selection: AlN / Al2O3 / Si3N4
- Process matching: DBC / AMB / DPC
- Suitable for high thermal density and high reliability applications
Thick Copper / Multilayer / High-Reliability PCB
- Process evaluation for thick copper, blind vias, and complex structures
- Supports industrial, automotive, and aerospace-grade requirements
- Fast iteration with stable production delivery
Industries Applications
IGBT Power Modules
Suitable for high current and high heat dissipation applications
- Aluminum Nitride (AlN) substrates with high thermal conductivity
- DBC / AMB processes for high current and high reliability
- Widely used in new energy inverters and industrial power modules
Recommended SolutionAlN + DBC / AMB structure
Electric Vehicles / Charging Stations
Designed for high temperature, vibration, and long lifetime requirements
- Applicable to e-drive systems and OBC onboard charging modules
- Excellent thermal and mechanical reliability for automotive applications
- Supports high current and long-term stable operation
Recommended SolutionSi3N4-AMB / AlN solution
Laser Diodes
Suitable for high thermal density and temperature-sensitive applications
- High thermal conductivity ceramic substrates to reduce thermal resistance
- Used in optical communication and industrial laser systems
- Supports precision structures and compact packaging
Recommended SolutionAlN + DPC fine line structure
LED Thermal Management Substrates
Suitable for high power LED packaging and continuous heat dissipation
- Replaces traditional aluminum substrates with improved thermal performance
- Suitable for high-power LED and COB packaging
- Extends lifespan and reduces lumen degradation
Recommended SolutionAl2O3 / AlN solution
Engineering Capabilities
We evaluate feasibility before quoting
- Early-stage engineering evaluation (materials / structure / process)
- Identify thermal and reliability risks in advance
- Reduce trial-and-error and accelerate project progress
Material & process matching expertise
- Experience in high-frequency material selection (Rogers / Megtron)
- Thermal and insulation optimization for ceramic PCB
- Recommend suitable solutions based on application requirements
Multi-process integration & delivery
- Covers ceramic, heavy copper, high-frequency and other processes
- Supports prototyping, small batch, and mass production
- Match the optimal manufacturing approach for each project