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Bring Your High-Speed, High-Frequency PCBs to Market Faster
Engineering-Driven · High Reliability · Supports Small to Medium Batch Production

With extensive engineering experience and advanced manufacturing capabilities, Chongyu Technology provides full-process PCB support from design evaluation to production, ensuring signal integrity, efficient manufacturing, and controlled risk.

Get an Engineering AssessmentExplore Materials & Process Capabilities

Challenges in PCB Projects

Signal Integrity Challenges

High-speed signals prone to crosstalk and loss, affecting stable performance

High Production Risks

Long design-to-production cycles with potential reliability issues

Slow Prototyping

Time-consuming prototype validation slows down iterative development

Material & Process Mismatch

Balancing material performance and process requirements can lead to rework

Core Product Direction

High-Frequency & High-Speed PCB

AI, Server, and High-Speed Communication Scenarios

  • Backplane / AI / 112G / 224G Signal Support
  • Multi-layer HDI Design, Low Crosstalk & Low Loss
  • Rapid Prototyping to Small-Batch Production

Ceramic PCB

High Thermal Conductivity, High Insulation, High Reliability

  • Alumina / Aluminum Nitride Materials
  • Excellent Thermal Management & Mechanical Stability
  • Suitable for Power Modules & High-Power Density Applications

High Reliability & Special Processes

Thick Copper, Plugged Vias, Complex Multi-layer Design

  • Compliant with Industrial / Aerospace / Automotive Standards
  • Supports Rapid Iteration & Mass Production Delivery
  • Engineering Optimization & Material Matching Suggestions

Industry Applications

Telecom & Server

  • High-Frequency Signal Transmission & High-Speed Interfaces
  • Data Center & Server Board Design

New Energy / Automotive Electronics

  • High-Power Supply & Automotive-Grade Boards
  • Strong Temperature & Vibration Adaptability

Medical / Industrial Control

  • Precision Control Boards & High-Reliability Modules
  • Long-Term Stable Operation with Low Failure Rate

Semiconductor Equipment

  • Equipment Control Boards & High-Speed Acquisition
  • Balancing High-Frequency Signals & Power

Engineering Capabilities

Engineering-Oriented

  • In-Depth Evaluation to Optimize Design Solutions
  • Reduce Production Risks & Shorten Iteration Cycles

Materials & Process Expertise

  • High-Frequency PCB Material Selection Experience
  • Thermal Conductivity & Insulation Optimization for Ceramic PCB

Supply Chain Coverage

  • Fast Response from Major Domestic PCB Factories
  • Full Support from Prototyping to Mass Production Delivery