Ceramic PCB (AlN / DBC / AMB) Solutions
Engineering-Driven · High Reliability · Supports Small to Medium Batch Production

With extensive engineering experience and advanced manufacturing capabilities, Chongyu Technology provides full-process PCB support from design evaluation to production, ensuring signal integrity, efficient manufacturing, and controlled risk.

Common Concerns

Is the ceramic PCB cost reasonable?

Differences in materials (AlN / Al₂O₃ / Si₃N₄) and processes (DBC / AMB / heavy copper) can be significant. We provide material and process selection recommendations based on your application needs, helping you achieve the optimal balance between performance and cost.

Will the thermal performance meet requirements?

For high-power applications such as IGBT and laser systems, we offer material selection and structural optimization to ensure thermal performance meets your design needs.

Is the lead time reliable?

Supports fast prototyping within 8–18 days and provides stable mass production delivery to avoid project delays.

Frequent design changes leading to long development cycles?

Early-stage engineering evaluation helps optimize materials, structure, and processes, reducing trial-and-error and accelerating project implementation.

Core Product Direction

High-Frequency & High-Speed PCB

AI, Server, and High-Speed Communication Scenarios

  • Backplane / AI / 112G / 224G Signal Support
  • Multi-layer HDI Design, Low Crosstalk & Low Loss
  • Rapid Prototyping to Small-Batch Production

Ceramic PCB (AlN / Al₂O₃ / Si₃N₄)

High Thermal Conductivity, High Insulation, High Reliability

  • Aluminum Nitride (AlN) substrates with high thermal conductivity
  • DBC / AMB / heavy copper processes
  • Applications: IGBT power modules, laser systems, and LED thermal management

High Reliability & Special Processes

Thick Copper, Plugged Vias, Complex Multi-layer Design

  • Compliant with Industrial / Aerospace / Automotive Standards
  • Supports Rapid Iteration & Mass Production Delivery
  • Engineering Optimization & Material Matching Suggestions

Industries Applications

IGBT Power Modules

  • Aluminum Nitride (AlN) substrates with high thermal conductivity (170 W/mK)
  • DBC / AMB processes suitable for high current and high reliability

Electric Vehicles / Charging Stations

  • Applicable to e-drive systems and OBC onboard charging modules
  • High temperature and vibration resistance, meeting automotive-grade requirements

Laser Diodes

  • High thermal conductivity ceramic substrates to reduce thermal resistance
  • Suitable for optical communication and industrial laser equipment

LED Thermal Management Substrates

  • Replaces traditional aluminum substrates with improved thermal conductivity
  • Suitable for high-power LED and COB packaging

Engineering Capabilities

Engineering-Oriented

  • In-Depth Evaluation to Optimize Design Solutions
  • Reduce Production Risks & Shorten Iteration Cycles

Materials & Process Expertise

  • High-Frequency PCB Material Selection Experience
  • Thermal Conductivity & Insulation Optimization for Ceramic PCB

Multi-Process Integration Capability

  • Covers multiple process technologies including ceramic, heavy copper, and high-frequency solutions
  • Matches the optimal manufacturing solution based on your project requirements